3 Popular Motherboard Layered Heating Platforms

 In professional mobile phone repair, it is very necessary to have a heating platform. Today we phonefix will share several motherboard layered heating platforms.

JC iHeater Pre-heating Station

The newly upgraded JC iHeater heating desoldering station is suitable for iPhone 13/13 Pro/13 Pro Max/13 mini. The third generation JC iHeater iPhone X-13 Pro Max motherboard CPU IC screen frame FACE ID point projector Android phone repair warm-up station.

The platform features intelligent temperature control, motherboard protection, solder desoldering, 70-260°C safety adjustable, digital tube display, double-button design, and an integrated design of soldering and desoldering.

This warm-up platform is a good choice for mobile phone repairs.

Mechanic iT3 Preheating Platform 

Mechanic iT3 Pro intelligent temperature control preheating platform iPhone X-13 PRO Max motherboard layer separation and bonding, iPhone Face ID dot matrix machine CPU IC rear camera tin planting BGA desoldering and glue removal repair.

This platform is intelligently temperature-adjustable, modular design, no air gun, soldering iron, plug and play, multiple combination modules, good scalability, easy to expand new modules.

It is very suitable for iPhone motherboard layered lamination, tin planting, BGA desoldering, IC degumming, dot-matrix Face ID repair, and rear camera repair.

SS-T12A Desoldering Pre-Heating Station

SUNSHINE SS-T12A iPhone X upper/lower motherboard preheating station adopts special heating design and precise temperature control ability, which can accurately locate the required heating parts. The SS-T12A adopts a dual bayonet design, which makes the iphone X motherboard stable. SUNSHINE SS-T12A has EU, Australia and US plugs, 110V or 220V for your choice.

The SS-T12A only heats the area where the IP-X board needs to be removed to prevent improper heating. The dual bayonet design ensures that the iP-X motherboard is stable on the stage. High-purity copper is used as the thin film to ensure uniform heat transfer.


That's it for the sharing of the motherboard layered heating platform. If you want to know more about phonefix, please leave a message below.

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